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11/5/2024
Usa - New York - Malta, US
3D Heterogenous Integration Engineer (2025 New College Graduate)
Usa - New York - Malta, US
3D Heterogeneous Integration and Advanced Packaging Engineering Intern (Summer 2025)
11/2/2024
Dresden, DE
PhD Thesis: Integration of low stress Copper into ultra-thick BEOL redistribution layers
11/1/2024
Bgr - Sofia, Bulgaria
BGR Device Engineer, ESD
10/30/2024
Ind - Karnataka - Bangalore, IN
D365 Senior Technical Consultant
Singapore, SG
Engineer Safety & Emergency Response
10/29/2024
Deu - Saxony - Dresden, DE
Werkstudent*in Prozessintegration in der Halbleiterei
Dresden, DE
Werkstudent*in CFM Metrology
10/22/2024
Ind - Karnataka - Bangalore, IN
Sr Associate Engineer Semiconductor Manufacturing - BSc / Diploma Graduates
10/21/2024
Yokohama, JP
Principal Account Specialist
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