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11/5/2024
Usa - New York - Malta, US
3D Heterogenous Integration Engineer (2025 New College Graduate)
Usa - New York - Malta, US
3D Heterogeneous Integration and Advanced Packaging Engineering Intern (Summer 2025)
Usa - Texas - Austin, US
Employee Communications Intern (Summer 2025)
Essex Junction, US
Logistics Technician - Night Shift
Offsite
Project Manager
Singapore, SG
Senior Device Modeling Engineer
Singapore, SG
Device Modeling Engineer
11/4/2024
Singapore, SG
Sr Analyst, Digital Manufacturing
11/2/2024
Dresden, DE
PhD Thesis: Integration of low stress Copper into ultra-thick BEOL redistribution layers
11/1/2024
Usa - Texas - Richardson, US
Analog/Power IC Design Engineer (2025 New College Graduate)
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