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Micron Technology
25 mile radius of Singapore
4/24/2025
Singapore, Singapore
Senior/Engineer, Advanced Packaging Integration - Post Wafer Fabrication (PWF)
Singapore, Singapore
Senior/Engineer, Advanced Packaging Die Level Technology - Molding
Singapore, Singapore
Senior/Engineer, Advanced Packaging Wafer Level Technology - Physical Vapor Deposition (PVD)/ Chemical Vapor Deposition (CVD)/ Reflow
Singapore, Singapore
Senior/ Engineer, Advanced Packaging Wafer Level Technology - Hybrid Bonding
Singapore, Singapore
Senior/ Engineer, Advanced Packaging Wafer Level Technology - Bonding/Debonding
Singapore, Singapore
Senior/ Engineer, Advanced Packaging Wafer Level Technology - Bumping (Plating/Photo/Wet)
Singapore, Singapore
Senior/ Engineer, Advanced Packaging Real-Time Defect Analysis (RDA)
Singapore, Singapore
Senior/Engineer, Advanced Packaging Die Level Technology - Materials
Singapore, Singapore
Senior/Engineer, Advanced Packaging Wafer Level Technology -Chemical Mechanical Planarization (CMP) / Grinding
Singapore, Singapore
Senior/Engineer, Advanced Packaging Integration - Assembly
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